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Amazon found 3 results for Flip Chip Ball Grid Array:


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Area Array Packaging Handbook: Manufacturing and Assembly
Price: $131.00  $24.78
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Area Array Packaging Handbook: Manufacturing and Assembly                     
Chip Scale Package: Design, Materials, Process, Reliability, and Applications
Price: $89.50  $144.44
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Chip Scale Package: Design, Materials, Process, Reliability, and Applications
Area Array Packaging Processes: for BGA, Flip Chip, and CSP
Price: $129.50  $31.50
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Area Array Packaging Processes: for BGA, Flip Chip, and CSP                     




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