Hybrid Microelectronics Handbook
from $8.40
PROCEEDINGS OF THE INTERNATIONAL ELECTRONIC PACKAGING TECH C
from $511.25
Packaging of Electronic & Photonic Devices: Presented at the 2000 Asme International Mechanical Engineering Congress and Exposition, November 5-10, 2000, Orlando, Florida (Eep (Series), Vol. 28.)
from $154.68
Sensors in electronic packaging: Presented at the 1995 ASME International Mechanical Engineering Congress and Exposition, November 12-17, 1995, San Francisco, California (MED)
from $86.85
Advances in electronic packaging, 1995: Proceedings of the International Intersociety Electronic Packaging Conference, INTERpack '95 : presented at ... 26-30, 1995, Lahaina, Maui, Hawaii (EEP)
from $594.64
Sensing, Modeling and Simulation in Emerging Electronic Packaging
from $92.69
Print proceedings of the InterPACK International Technical Conference on Packaging and Integration of Electronic and Photonic Microsystems Conference and Exhibition (IPACK2019)
$382.70
from $288.77
Optoelectronic Integrated Circuits and Packaging III: 28-29 January, 1999, San Jose, California (Proceedings of Spie--The International Society for Optical Engineering, V. 3631.)
from $80.00
Design, Characterization, and Packaging for Mems and Microelectronics: 27-29 October 1999, Royal Pines Resort, Queensland, Australia (Proceedings of ... Society for Optical Engineering, V. 3893.)
from $105.00
Cae - CAD Application to Electronic Packaging: 1994 International Mechanical Engineering Congress & Exposition, Chicago, Illinois - November 6-11, 199 (Eep -)
from $200.00
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